Exhibiting with the theme of OKUNO's technology contributing to the development of electronics!
Okuno Pharmaceutical Industry's technical consultation desk for surface treatment and plating offers solutions to your problems related to semiconductor packaging and assembly.
■JPCA Show 2023 / Exhibition of Semiconductor Packaging and Embedded Component Technologies■ Okuno Pharmaceutical Industry will be exhibiting at the Semiconductor Packaging Exhibition within JPCA Show 2023, which will be held at Tokyo Big Sight from May 31 (Wednesday) to June 2 (Friday), 2023. We will showcase a variety of new products, including plating technologies for wafers, package substrates, printed circuit boards, and FPCs, as well as plating processes for power modules and glass materials for electronic components. Please visit our booth at Tokyo Big Sight, East Hall 6, 6C-05. ■Introducing Products for Printed Circuit Boards / Semiconductor Package Substrates■ To help you learn more about us, we will introduce our products for printed circuit boards and semiconductor package substrates. If you have any questions regarding surface treatment, please feel free to contact us. *For more details, please download the PDF or contact us directly.*
- Company：奥野製薬工業 大阪・放出、東京、名古屋など
- Price：Other
